AUTOMATING THICK FILM PROCESSES IMPROVES HYBRID CIRCUITS.

被引：0

作者：

Cundy, Alan S.

机构：

来源：

Electri-onics | 1983年 / 29卷 / 11期

关键词：

INTEGRATED CIRCUITS; THICK FILM - Manufacture;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Described is a 'new generation' printer developed to meet both close tolerance thick film printing and large area substrates in the 4 in. square to 12 in. square range. The new design allows both mechanical and control functions to be modular. As an example, the print head can be mounted to any form of substrate feeder, as all of the printing parameters are contained in the head.

引用

页码：27 / 30

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