AUTOMATING THICK FILM PROCESSES IMPROVES HYBRID CIRCUITS.

被引：0
|
作者：
Cundy, Alan S.
机构：
来源：
Electri-onics | 1983年 / 29卷 / 11期
关键词：
INTEGRATED CIRCUITS; THICK FILM - Manufacture;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Described is a 'new generation' printer developed to meet both close tolerance thick film printing and large area substrates in the 4 in. square to 12 in. square range. The new design allows both mechanical and control functions to be modular. As an example, the print head can be mounted to any form of substrate feeder, as all of the printing parameters are contained in the head.
引用
收藏
页码：27 / 30
相关论文
共 50 条
  • [1] Thick-film Hybrid Circuits.
    Winiger, Franz
    1600, (51):
  • [2] Substrates of Thick Film Hybrid Circuits.
    Sztaba, Olgierda
    Lusniak-Wojcicka, Danuta
    Gandurska, Joanna
    Elektronika Warszawa, 1981, 22 (06): : 7 - 9
  • [3] THICK AND THIN FILM HYBRID CIRCUITS.
    Marathe, B.R.
    Journal of the Institution of Engineers. India. Electronics and telecommunication engineering division, 1985, 65 : 119 - 127
  • [4] Materials for Thick-Film Hybrid Circuits.
    Szczepanski, Zbigniew
    Fortuna, Elzbieta
    1600, (22): : 7 - 8
  • [5] DESIGN GUIDELINES FOR THICK-FILM HYBRID CIRCUITS.
    Dryden, William G.
    Electronic Packaging and Production, 1979, 19 (07): : 140 - 145
  • [6] HYBRID THICK - FILM CIRCUITS. THEIR DESIGN, APPLICATION AND MANUFACTURE.
    Brooke, G.
    Baldwin, W.E.B.
    Wireless World, 1973, 79 (1449): : 121 - 125
  • [7] THIN FILM HYBRID CIRCUITS.
    Travis, William
    New Electronics, 1980, 13 (20):
  • [8] FABRICATION OF THICK-FILM ELECTRONIC CIRCUITS.
    Onyshkevych Lubomyr Stephen
    RCA technical notes, 1981, (1275): : 1 - 2
  • [9] Contribution to Computer-Aided Design of Thick-Film Hybrid Circuits.
    Ripka, Gabor
    Reczey, Maria
    Kienast, Woldemar
    Burkhardt, Winfrid
    Wissenschaftliche Zeitschrift - Technische Hochschule Ilmenau, 1980, 26 (02): : 101 - 118
  • [10] Automating Thick Film Circuits Production.
    Castanos Dorrego, Juan Antonio
    Mundo electronico. Edicion internacional, 1987, (169): : 70 - 79
12345