VACANCY ORDERED PHASES IN RAPIDLY SOLIDIFIED ALUMINIUM-COPPER ALLOYS.

被引:0
|
作者
Sastry, Gunturi V.S.
Bariar, Krishna Kumar
Chattopadhyay, Kamanio
Ramachandrarao, Patcha
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
An electron microscopic investigation on a rapidly solidified Al-45 at. % Cu alloy has established, for the first time, the formation of vacancy-ordered binary tau phases. Evidence has also been gathered for the formation of another defect structure, Al//4Cu//9, akin to that obtained by vapor deposition.
引用
收藏
页码:756 / 759
相关论文
共 50 条
  • [41] DIRECTIONAL SOLIDIFICATION OF ALUMINIUM-COPPER ALLOYS IN A MAGNETIC FIELD
    YOUDELIS, WV
    DORWARD, RC
    CANADIAN JOURNAL OF PHYSICS, 1966, 44 (01) : 139 - &
  • [42] Extension of the performance of aluminium-copper alloys by spray forming
    Schimanski, K
    Schulz, A
    Vetters, H
    Bauckhage, K
    Mayr, P
    ADVANCED ENGINEERING MATERIALS, 2004, 6 (11) : 879 - 883
  • [43] SOME METALLOGRAPHIC OBSERVATIONS ON AGED ALUMINIUM-COPPER ALLOYS
    POLMEAR, IJ
    HARDY, HK
    JOURNAL OF THE INSTITUTE OF METALS, 1953, 81 (08): : 427 - 431
  • [44] ON PRECIPITATION IN RAPIDLY SOLIDIFIED ALUMINIUM-SILICON ALLOYS
    VANMOURIK, P
    MITTEMEIJER, EJ
    DEKEIJSER, TH
    JOURNAL OF MATERIALS SCIENCE, 1983, 18 (09) : 2706 - 2720
  • [45] Texture of rapidly solidified foils of aluminium and its alloys
    Shepelevich, VG
    Siutsova, PA
    Neumerzhytskaya, EY
    Gutko, ES
    Kuckorecko, KV
    JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 403 (1-2) : 267 - 269
  • [46] Texture of rapidly solidified foils of aluminium and its alloys
    Shepelevich, V.G.
    Siutsova, P.A.
    Neumerzhytskaya, E.Yu.
    Gutko, E.S.
    Kuckorecko, K.V.
    Journal of Alloys and Compounds, 2005, 403 (1-2): : 267 - 269
  • [47] Enrichment, incorporation and oxidation of copper during anodising of aluminium-copper alloys
    Curioni, M.
    Roeth, F.
    Garcia-Vergara, S. J.
    Hashimoto, T.
    Skeldon, P.
    Thompson, G. E.
    Ferguson, J.
    SURFACE AND INTERFACE ANALYSIS, 2010, 42 (04) : 234 - 240
  • [48] RAPIDLY SOLIDIFIED COPPER-BORON ALLOYS
    COOKEY, RH
    WOOD, JV
    INTERNATIONAL JOURNAL OF RAPID SOLIDIFICATION, 1988, 3 (04): : 319 - 337
  • [49] Properties of rapidly solidified binary copper alloys
    Olofinjana, AO
    Atrens, A
    MATERIALS LETTERS, 1997, 31 (1-2) : 87 - 92
  • [50] ELECTRODEPOSITION OF ALUMINIUM-COPPER ALLOYS FROM ALKYL BENZENE ELECTROLYTES
    CAPUANO, GA
    DUCASSE, R
    DAVENPORT, WG
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 1979, 9 (01) : 7 - 13