New practical approach to determine solder paste tackiness

被引：0
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作者：
Doss, Kantesh [1 ]
机构：
[1] Siemens Electronics Manufacturing, Cent, Johnson City, United States
来源：
National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) | 1999年 / 1卷
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页码：202 / 211
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