Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling

被引：33
|
作者：
机构：
[1] Hong, Bor Zen
[2] Burrell, Lloyd G.
来源：
Hong, Bor Zen | 1600年 / IEEE, Piscataway, NJ, United States卷 / 18期
关键词：
421 Strength of Building Materials; Mechanical Properties - 537.1 Heat Treatment Processes - 538.1.1 Soldering - 714.2 Semiconductor Devices and Integrated Circuits - 723.5 Computer Applications - 921.6 Numerical Methods;
D O I：
10.1109/95.465156
中图分类号：
学科分类号：
摘要：
23
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