The Finite Element Analysis of Solder Joints under Temperature Cycling

被引：0

作者：

Liu, Fangyi ^{[1
]}

Lou, Wenzhong ^{[1
]}

Wang, Fufu ^{[1
]}

Ding, Xuran ^{[1
]}

Wang, Dakui ^{[1
]}

机构：

[1] Beijing Inst Technol, Sch Mechatron Engn, State Key Lab Mech Engn & Control, Beijing 100081, Peoples R China

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

FEM; flip-chip; solder joint; temperature cycling; delamination;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (-45 degrees C similar to 125 degrees C) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation, and then cracks, extension, interlayer delaminating. The failure of the solder joints may cause the failure of the entire switch. This paper aims to simulate the periodic changes in temperature and obtain the reliability and potential failure modes of solder joints under temperature cycling, thus providing theory reference for the design and application of the novel solid MEMS switch.

引用

页码：214 / 218

页数：5

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