共 50 条
- [11] SMT solder joint's shape and location optimization using modified genetic algorithm in the dynamic loadings 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, : 169 - 173
- [13] To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 313 - 317
- [14] Research of SMT solder joint virtual evolving and SMT product virtual mount technology Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS, 1998, 4 (05): : 46 - 50
- [16] Development of an integrated design system for thermal reliability prediction of SMT solder interconnects Journal of Electronic Packaging, Transactions of the ASME, 1996, 118 (04): : 235 - 243
- [17] 3-D Reconstruction for SMT Solder Joint Based on Joint Shadow 2015 27TH CHINESE CONTROL AND DECISION CONFERENCE (CCDC), 2015, : 5766 - 5772
- [18] Thermomechanical reliability of lead free solder joint in SMT assembly 2007 30TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2007, : 123 - 127
- [19] A highlight processing technology for SMT solder joint gray image 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 898 - 901
- [20] Fine pitch BGA solder joint split in SMT process IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 529 - 532