Solder joint reliability of plastic ball grid array packages

被引：0
|
作者：
Zhong, Chong Hua [1 ]
Yi, Sung [1 ]
机构：
[1] Advanced Micro Devices (Singapore), Pte Ltd, Singapore, Singapore
来源：
Soldering and Surface Mount Technology | 1999年 / 11卷 / 01期
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D O I：
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学科分类号：
摘要：
10
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页码：44 / 48
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