共 50 条
- [31] ADDITIVE METHODS FOR PRODUCTION OF PRINTED-CIRCUIT BOARDS. Soviet electrical engineering, 1979, 50 (04): : 72 - 76
- [32] Automatic Adjustment Associated with Testing of Printed Circuit Boards. Elektronik Produktion & Prueftechnik, 1987, (09): : 23 - 24
- [34] ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS. Electri-onics, 1986, 32 (03): : 29 - 32
- [35] Binary Photosensitizers for Fully Additive Production of Printed Circuit Boards. MO Metalloberflache Beschichten von Metall und Kunststoff, 1986, 40 (02): : 67 - 69
- [37] Developing a decoupling methodology with SPICE for multilayer printed circuit boards. 1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, VOLS 1 AND 2, 1998, : 652 - 655
- [38] EFFECTS OF INTEGRATED CIRCUITS ON USAGE TRENDS FOR PRINTED CIRCUIT BOARDS. Insulation, circuits, 1980, 26 (09): : 37 - 39
- [39] GUIDE TO BROACHING FASTENERS FOR PLASTIC PRINTED-CIRCUIT BOARDS. Plastics Engineering, 1981, 37 (08): : 26 - 28
- [40] HIGH DENSITY INTERCONNECTION USING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARDS. Denshi Tokyo/Electron Tokyo, 1981, (20): : 123 - 126