APPROACHES TO SURFACE-MOUNT TECHNOLOGY.

被引：0

作者：

Langan, James P. ^{[1
]}

机构：

[1] Enthone Inc, West Haven, CT, USA, Enthone Inc, West Haven, CT, USA

来源：

| 1600年 / 74期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

PRINTED CIRCUITS

引用

共 50 条

[41] CHOOSING THE RIGHT SURFACE-MOUNT ADHESIVE
MURRAY, B
MACHINE DESIGN, 1984, 56 (24) : 89 - 93
[42] All about surface-mount ferrites
Hill, Lee
EDN, 2008, 53 (17) : 22 - 22
[43] SURFACE-MOUNT PASSIVES ARE COMING ON STRONG
MATTERA, L
ELECTRONICS, 1988, 61 (03): : 99 - 99
[44] Epoxy is used for surface-mount devices
Modern Plastics, 1999, 76 (02):
[45] HOW TO TEST SURFACE-MOUNT CIRCUITS
不详
ELECTRONICS & WIRELESS WORLD, 1989, 95 (1638): : 387 - 387
[46] Improving surface-mount assembly yields
McClure, Doug
Circuits Assembly, 2000, 11 (06):
[47] SURFACE-MOUNT COMPONENTS BOOST PERFORMANCE
CANONICO, B
ELECTRONIC PRODUCTS MAGAZINE, 1984, 27 (01): : 22 - 23
[48] Process control in surface-mount reflow
Lange, Roy
Circuits Assembly, 1994, 5 (10):
[49] Advanced surface-mount manufacturing methods
Belmonte, Joe
Zarrow, Phil
Circuits Assembly, 1996, 7 (09):
[50] SURFACE-MOUNT CONNECTORS - SPECIAL REPORT
MOSLEY, JD
EDN, 1987, 32 (20) : 142 - &