共 50 条
- [1] SILICON-WAFER DIRECT BONDING WITHOUT HYDROPHILIC NATIVE OXIDES JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (1A): : 6 - 10
- [4] Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces Microsystem Technologies, 2018, 24 : 801 - 808
- [5] Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 801 - 808
- [8] Direct wafer bonding and layer transfer - a new approach to integration of ferroelectric oxides into silicon technology Ferroelectrics, 1 -4 pt 3 (169-178):
- [9] Direct wafer bonding and layer transfer: An innovative way for the integration of ferroelectric oxides into silicon technology FERROELECTRIC THIN FILMS VI, 1998, 493 : 517 - 522