Testing and Preservation of Solderability of Electronic Components.

被引：0
|
作者：
Rohrberg, Ruediger
Labs, Juergen
机构：
来源：
Schweisstechnik (Berlin) | 1973年 / 23卷 / 04期
关键词：
ELECTRONIC CIRCUITS - SOLDERING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The various methods for testing the quality of soldered joints, applicable in the practice of soldering of electronic components and printed circuit boards, are described. Good results are obtained by electrodepositing a tin coating on soldered parts and after a longer storage. It is suggested that, for economical and practical reasons and also for preserving the solderability of the soldered parts, the tin coating should replace the conventional silvr coating.
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页码：149 / 152
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