KEEPING PACE WITH THE OPTIONS IN IC PACKAGING.

被引：0
|
作者：
Marks, Richard L. [1 ]
机构：
[1] AMP Inc, Harrisburg, PA, USA, AMP Inc, Harrisburg, PA, USA
来源：
Design News (Boston) | 1985年 / 41卷 / 12期
关键词：
D O I：
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学科分类号：
摘要：
INTEGRATED CIRCUITS
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页码：139 / 142
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