EVOLUTION OF SMT METALLIZED FILM CAPACITORS.

被引：0

作者：

Fabbri, C. ^{[1
]}

Bernadi, A. ^{[1
]}

机构：

[1] Arcotronics Italia SpA, Arcotronics Italia SpA

来源：

JEE. Journal of electronic engineering | 1987年 / 24卷 / 252期

关键词：

INTEGRATED CIRCUITS - Electronics Packaging - PLASTICS - SOLDERING;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

After the first experimental phase, surface mount technology (SMT) plstic film chip capacitors have been introduced in the production environment of many companies. The hardest obstacle to overcome has been the soldering process. The dielectric now available is metallized polyester (MKT). Other dielectrics are under evaluation, mainly for the higher working temeprature allowed. PPS is the most promising materials.

引用

页码：32 / 37

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