Effect of cure rate of rubber compound on the adhesion to copper-plated steel cord

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作者：
机构：
[1] [1,Jeon, Gyung Soo
[2] Jeong, Seung Won
来源：
Jeon, G.S. (gjeon@damyang.ac.kr) | 1600年 / Taylor and Francis Ltd.卷 / 79期
关键词：
Atmospheric humidity - Brass plating - Copper compounds - Copper plating - Crosslinking - Density (specific gravity) - Growth (materials) - Moisture - Rubber - Strength of materials - Stress analysis - Structure (composition) - Substitution reactions - Vulcanization;
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摘要：
Copper-plated steel cord was prepared and its adhesion properties to rubber compounds, which have different loading amounts of both sulfur and accelerator, were examined in comparison with brass-plated steel cord. The lower pullout force of copper-plated steel cord to the rubber compounds was shown compared with brass-plated steel cord. The copper-plated steel cord showed higher adhesion retention to rubber compounds than brass-plated steel cord against various hostile environments. The stability against both humidity aging and thermal aging, and the cause for the high adhesion retention of the copper-plated steel cord to rubber compounds, were discussed compared with those of the brass-plated steel cord. The pullout force of copper-plated steel cord to rubber compound is inversely correlated with cure rate after various aging treatments.
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