共 50 条
- [43] Packaging in the IT environment - Competing challenges in the design of packaging for electronic products 2005 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS & THE ENVIRONMENT, CONFERENCE RECORD, 2005, : 93 - 95
- [47] PackMolds: computational design of packaging molds for thermoforming VISUAL COMPUTER, 2024, 40 (07): : 4689 - 4700
- [49] Experimental methods and tools in electronic packaging applications THIRD INTERNATIONAL CONFERENCE ON EXPERIMENTAL MECHANICS, 2002, 4537 : 14 - 19