MEMORY SYSTEM RELIABILITY ENHANCEMENT BY MODULE SWAPPING.

被引：0
|
作者：
Cecchi, D.R.
机构：
来源：
| 1600年 / 25期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
DATA STORAGE, SEMICONDUCTOR
引用
收藏
相关论文
共 50 条
  • [41] Simulation on reliability enhancement testing technology of ramming system
    Hu H.-B.
    Cao L.-J.
    Chen S.-X.
    Ma J.-S.
    Journal of Shanghai Jiaotong University (Science), 2015, 20 (04) : 477 - 481
  • [42] Demand Response based Power System Reliability Enhancement
    Kamruzzaman, Md.
    Benidris, Mohammed
    2018 IEEE INTERNATIONAL CONFERENCE ON PROBABILISTIC METHODS APPLIED TO POWER SYSTEMS (PMAPS), 2018,
  • [43] RELIABILITY ENHANCEMENT OF REACTOR PROTECTION SYSTEM FOR BWR PLANTS
    ARITA, S
    ITO, T
    NOGUCHI, A
    MURATA, F
    JOURNAL OF THE ATOMIC ENERGY SOCIETY OF JAPAN, 1992, 34 (05): : 444 - 454
  • [44] Power System Reliability Enhancement Considering Smart Monitoring
    Falahati, Bamdad
    Kargarian, Amin
    2015 IEEE POWER & ENERGY SOCIETY GENERAL MEETING, 2015,
  • [45] Evaluation of a Module Based Memory System with an LCP Flex Interconnect
    Kollipara, Ravi
    Li, Ming
    Mullen, Don
    Beyene, Wendemagegnehu
    Madden, Chris
    Yuan, Chuck
    Kusamitsu, Hideki
    Ito, Toshiyasu
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1200 - +
  • [46] SwaMURAy - Swapping Memory Unit for Radio Astronomy
    Winberg, Simon
    2015 IEEE RADIO AND ANTENNA DAYS OF THE INDIAN OCEAN (RADIO), 2015,
  • [47] Design and Testing of a High Speed Module Based Memory System
    Kollipara, Ravi
    Li, Ming
    Mullen, Don
    Beyene, Wendemagegnehu
    Madden, Chris
    Yuan, Chuck
    Kusamitsu, Hideki
    Ito, Toshiyasu
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2009, : 191 - +
  • [48] Enhancement of the Multi-Module Memory Bus for Signal Integrity by Using Genetic Algorithm
    Wu, Chun-Te
    Lin, Ding-Bing
    2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 157 - 160
  • [49] Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module
    Huang, C. J.
    Chou, C. Y.
    Chiang, K. N.
    EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, : 424 - 428
  • [50] A study on component swapping modularity for battery module control system of a plug-in HEV based on feedback control
    Lin, C., 1600, SAE-China (36):
12345