SPICE-models for high-pincount board connectors

被引：0
|
作者：
Siemens AG, Munich, Germany [1 ]
机构：
来源：
IEEE Trans Compon Packag Manuf Technol Part B Adv Packag | / 1卷 / 3-6期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 31 条
  • [1] SPICE-models for high-pincount board connectors
    Katzier, H
    Reischl, R
    Pagnin, P
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01): : 3 - 6
  • [2] Spice-Models with Independent Agents
    Gorbaneva, O., I
    AUTOMATION AND REMOTE CONTROL, 2019, 80 (09) : 1745 - 1753
  • [3] Spice-Models with Independent Agents
    O. I. Gorbaneva
    Automation and Remote Control, 2019, 80 : 1745 - 1753
  • [4] SPICE-models of coupled transmission lines
    Kraft, KH
    FREQUENZ, 2004, 58 (11-12) : 268 - 272
  • [5] Measurement and identification of the parameters of spice-models of a bipolar transistor
    Petrov, VN
    Petrov, MN
    Kapralov, SA
    MEASUREMENT TECHNIQUES, 2003, 46 (03) : 281 - 289
  • [6] Measurement and Identification of the Parameters of SPICE-Models of a Bipolar Transistor
    V. N. Petrov
    M. N. Petrov
    S. A. Kapralov
    Measurement Techniques, 2003, 46 : 281 - 289
  • [7] Field-based analysis of a high pincount board connector
    Wolter, H
    Katzier, H
    Podebrad, O
    Weiland, T
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01): : 23 - 31
  • [8] Field-based design of a new high pincount board connector for high data rate transmission
    Katzier, H.
    Keller, B.-M.
    Proceedings - Electronic Components and Technology Conference, 1996, : 456 - 459
  • [9] Field-based design of a new high pincount board connector for high data rate transmission
    Katzier, H
    Keller, BM
    Pagnin, P
    46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 456 - 459
  • [10] Board-to-board connectors: High-speed data transmission and electromagnetic compatibility - Board-to-board connectors for the All Electric Society
    Schafmeister, Arndt
    Schulze, Thomas
    Konstruktion, 2022, 74 (09): : 30 - 33
1234