Electronic chip mounting and high density packaging technology

被引：0
|
作者：
Koizumi, Mamoru [1 ]
Anaoh, Kimiharu [1 ]
机构：
[1] Murata Manufacturing Co, Japan
来源：
JEE. Journal of electronic engineering | 1988年 / 25卷 / 262期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：38 / 40
相关论文
共 50 条
  • [31] New technology for high-density LSI mounting in consumer products
    Kira, Hidehiko
    Takashima, Akira
    Ozaki, Yukio
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2007, 43 (01): : 41 - 49
  • [32] New technology for high-density LSI mounting in consumer products
    Kira, Hidehiko
    Takashima, Akira
    Ozaki, Yukio
    Fujitsu Scientific and Technical Journal, 2007, 43 (01): : 41 - 49
  • [33] Electronic packaging - Laser soldering changes chip packaging
    Brinkmann, U
    LASER FOCUS WORLD, 1998, 34 (03): : 24 - +
  • [34] MATERIALS FOR HIGH-DENSITY ELECTRONIC PACKAGING AND INTERCONNECTIONS IN THE HIGHER PACKAGING LEVELS
    NEUGEBAUER, CA
    JOURNAL OF ELECTRONIC MATERIALS, 1989, 18 (02) : 229 - 239
  • [35] High density, low cost packaging and interconnect technology
    Garrou, P
    2ND 1998 IEMT/IMC SYMPOSIUM, 1998, : 10 - 17
  • [36] Glass Interposer Technology Advances for High density Packaging
    Kuramochi, Satoru
    Kudo, Hiroshi
    Akazawa, Mivuki
    Mawatari, Hiroshi
    Tanaka, Masava
    Fukuoka, Yoshitaka
    2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 213 - 216
  • [37] New reliability technology for high density packaging design
    Kawata, Koji
    Tokumitsu, Yoshitaka
    Journal of Japan Institute of Electronics Packaging, 2008, 11 (05) : 343 - 347
  • [38] HIGH-DENSITY PACKAGING TECHNOLOGY TREND IN JAPAN
    MIYASHIRO, F
    IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS, 1991, 74 (08): : 2297 - 2300
  • [39] Reliability Study on High Density LED Packaging with Chip On Board Structures
    Hai, Yang
    Yang, D.
    Li, BoWei
    You, Zhi
    Ma, YaHui
    Liu, DoingJing
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1102 - 1107
  • [40] Technology requirements for chip-on-chip packaging solutions
    Töpper, M
    Fritzsch, T
    Glaw, V
    Jordan, R
    Lopper, C
    Röder, J
    Dietrich, L
    Lutz, M
    55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, : 802 - 808
12345