Conductive adhesives in medical applications

被引：0
|
作者：
Stratton, Bill
机构：
来源：
Interconnection Technology | 1993年 / 9卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] ANISOTROPIC CONDUCTIVE ADHESIVES FOR CHIP ON GLASS AND OTHER FLIP-CHIP APPLICATIONS
    VANNOORT, HM
    KLOOS, MJH
    SCHAFER, HEA
    JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (01): : 27 - 31
  • [42] High Temperature Performance of Low Stress Electrically Conductive Adhesives in Electronic Applications
    Dreezen, G.
    Theunissen, L.
    Luyckx, G.
    Dooling, P.
    Borak, A.
    2008 IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS AND 2008 IEEE INTERDISCIPLINARY CONFERENCE ON PORTABLE INFORMATION DEVICES, 2008, : 126 - +
  • [43] Development of benzoxazine-based composites for electrically conductive adhesives (ECAs) applications
    Matkaran, Kriengkrai
    Thubsuang, Uthen
    Wongkasemjit, Sujitra
    Chaisuwan, Thanyalak
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2016, 251
  • [44] Anisotropic alignment of nickel particles in a magnetic field for electronically conductive adhesives applications
    Sancaktar, E
    Dilsiz, N
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1997, 11 (02) : 155 - 166
  • [45] Highly reliable non-conductive adhesives for flip chip CSP applications
    Yim, MJ
    Hwang, JS
    Kwon, W
    Jang, KW
    Paik, KW
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (02): : 150 - 155
  • [46] High reliable non-conductive adhesives for flip chip CSP applications
    Yim, MJ
    Hwang, JS
    Kwon, WS
    Jang, KW
    Paik, KW
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1385 - 1389
  • [47] A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications
    Y. C. Lin
    Jue Zhong
    Journal of Materials Science, 2008, 43 : 3072 - 3093
  • [48] Mechanical Testing of Conductive Adhesives
    Kristiansen, Helge
    Kalland, Erik
    Helland, Susanne
    2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
  • [49] Trends of conductive adhesives in electronics
    Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki-shi, Osaka 567-0047, Japan
    不详
    不详
    不详
    J. Jpn. Inst. Electron. Packag., 2009, 1 (79-85):
  • [50] Characterization of anisotropic conductive adhesives
    Dasgupta, A
    Caers, J
    Iyer, P
    Baumgaertner, P
    Farley, D
    ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 19 - 25
12345