Diffusion barrier deposition on a copper surface by atomic layer deposition

被引:0
|
作者
ASM America Ltd., North Western Service Office, Building # C300, 3935NW Aloclek Place, Hillsboro, OR 27124-7114, United States [1 ]
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
15
引用
收藏
页码:149 / 153
相关论文
共 50 条
  • [31] Atomic layer deposition of calcium fluoride for barrier coating applications
    Hennessy, John
    Rodriguez, Robin E.
    West, William C.
    Brandon, Erik J.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2023, 41 (04):
  • [32] Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
    Xiong, Yuqing
    Gao, Hengjiao
    Ren, Ni
    Liu, Zhongwei
    PLASMA SCIENCE & TECHNOLOGY, 2018, 20 (03)
  • [33] Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
    熊玉卿
    高恒蛟
    任妮
    刘忠伟
    PlasmaScienceandTechnology, 2018, 20 (03) : 150 - 154
  • [34] Deposition of Cu barrier and seed layers with atomic layer control
    Haukka, S
    Raaijmakers, I
    Elers, KE
    Kostamo, J
    Li, WM
    Sprey, H
    Soininen, PJ
    Tuominen, M
    PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2002, : 279 - 281
  • [35] Characterization of oxide barrier layers prepared by atomic layer deposition
    Tsai, Fa-Ta
    Chao, Ching-Kong
    Jhong, Kai-Jyun
    Chang, Rwei-Ching
    ADVANCES IN MECHANICAL ENGINEERING, 2017, 9 (07)
  • [36] Oxidation barrier of Cu and Fe powder by Atomic Layer Deposition
    Cremers, Veronique
    Rampelberg, Geert
    Barhoum, Ahmed
    Walters, Perry
    Claes, Nathalie
    de Oliveira, Thais Milagres
    Van Assche, Guy
    Bals, Sara
    Dendooven, Jolien
    Detavernier, Christophe
    SURFACE & COATINGS TECHNOLOGY, 2018, 349 : 1032 - 1041
  • [37] Atomic layer deposition
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 2005, 84 (04): : 27 - 27
  • [38] Atomic layer deposition
    Godlewski, Marek
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2012, 27 (07)
  • [39] Atomic layer deposition
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 2006, 85 (06): : 13 - 13
  • [40] Atomic Layer Deposition
    Wang, SQ
    Sneh, O
    Londergan, A
    Clark-Phelps, B
    Lee, E
    Seidel, T
    SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 364 - 364