Coupling on a multilayer printed circuit board and the current distribution in the ground plane

被引：0
|
作者：
van, Horck, F.B.M.
van Deursen, A.P.J.
van der Laan, P.C.T.
机构：
来源：
EUT Report, Eindhoven University of Technology, Faculty of Electrical Engineering | 1996年 / 96-E-300期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] On the coupling of an external electromagnetic field to a printed circuit board trace
    Leone, M
    Singer, HL
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1999, 41 (04) : 418 - 424
  • [42] Enhanced pluggable out-of-plane coupling components for Printed Circuit Board-level optical interconnections
    Van Erps, J.
    Heyvaert, S.
    Debaes, C.
    Van Giel, B.
    Hendrickx, N.
    Van Daele, P.
    Thienpont, H.
    MICRO-OPTICS 2008, 2008, 6992
  • [43] Printed Circuit Board
    China's Foreign Trade, 1998, (01) : 14 - 14
  • [44] REFRACTED PHOTOGRAPHIC METHOD FOR GROUND PLANE PRINTED CIRCUIT BOARDS
    WILSON, FC
    PROCEEDINGS OF THE IEEE, 1969, 57 (12) : 2172 - &
  • [45] Flexible Printed Circuit Meshed Ground Plane Modeling Methodology
    Sreerama, Chaitanya
    Hall, Stephen H.
    Gantner, Eric
    2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI), 2017,
  • [46] Vein Power Plane for Printed Circuit Board Based on Constructal Theory
    Huang, Hui-Fen
    Wei-Guo
    Chu, Qing-Xin
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2011, 53 (04) : 987 - 995
  • [47] In-Plane Electromagnetic Generator Fabricated on Printed Circuit Board Technology
    Pan, C. T.
    Hsu, F. T.
    Nien, C. C.
    Liu, Z. H.
    Chen, Y. J.
    Chen, P. H.
    APPLIED SCIENCE AND PRECISION ENGINEERING INNOVATION, PTS 1 AND 2, 2014, 479-480 : 524 - +
  • [48] Planar fluxgate current sensor integrated in printed circuit board
    O'Donnell, Terence
    Tipek, A.
    Connell, A.
    McCloskey, P.
    O'Mathuna, S. C.
    SENSORS AND ACTUATORS A-PHYSICAL, 2006, 129 (1-2) : 20 - 24
  • [49] New eddy current technique for printed circuit board control
    Bilik, Y.
    Keydar, E.
    Boroda, V.
    MATERIALS EVALUATION, 2006, 64 (08) : 775 - 777
  • [50] Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
    Liew, Li-Anne
    Lin, Ching-Yi
    Lewis, Ryan
    Song, Susan
    Li, Qian
    Yang, Ronggui
    Lee, Y. C.
    JOURNAL OF ELECTRONIC PACKAGING, 2017, 139 (01)
12345