APPARATUS FOR STUDY OF THE NEUTRAL COMPONENT OF ION SURFACE SPUTTERING.

被引：0

作者：

Ayukhanov, A.Kh. ^{[1
]}

Kremkov, M.V. ^{[1
]}

Turmashev, E. ^{[1
]}

Khasanov, U. ^{[1
]}

机构：

[1] Acad of Sciences of the Uzbek SSR, Tashkent, USSR, Acad of Sciences of the Uzbek SSR, Tashkent, USSR

来源：

Instruments and experimental techniques New York | 1986年 / 29卷 / 2 pt 2期

关键词：

SPUTTERING;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The apparatus contains a source of alkali-metal ions whose beam has been made monoenergetic in the field of a 90 degree electrostatic condenser, a sputtering and ionization chamber, an additional ionizing target for the neutral component, a section-type mass spectrometer with a central angle of 60 degree set up for analysis of negative ions of light metals (up to 200 amu) and equipped with a scanning unit, and systems for signal amplification and recording. Mass spectra of the negatively ionized component of Nichrome, Si, and Ge sputtering are given.

引用

页码：437 / 440

共 50 条

[1] APPARATUS FOR STUDY OF THE NEUTRAL COMPONENT OF ION SURFACE SPUTTERING
AYUKHANOV, AK
KREMKOV, MV
TURMASHEV, E
KHASANOV, U
INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1986, 29 (02) : 437 - 440
[2] TECHNOLOGY OF ION BEAM SOURCES USED IN SPUTTERING.
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1600, (15):
[3] MECHANISMS OF ATOMIC ION EMISSION DURING SPUTTERING.
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[4] COMPUTER SIMULATION OF TWO-COMPONENT TARGET SPUTTERING.
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[5] SURFACE BINDING ENERGY IN SLOW COLLISIONAL SPUTTERING.
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Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 1986, B18 (4-6) : 388 - 398
[6] PREPARATION OF MAGNETIC GARNET FILMS BY ION BEAM SPUTTERING.
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[7] SURFACE DAMAGE AND TOPOGRAPHY CHANGES PRODUCED DURING SPUTTERING.
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1600, (18): : 1 - 2
[8] CONCERNING THE PROBLEM OF HIGH DEPTH RESOLUTION USING ION SPUTTERING.
Blaise, G.
Scanning Electron Microscopy, 1986, (pt 1) : 129 - 137
[9] EFFECT OF CONCENTRATION DEPENDENT SURFACE BINDING ENERGY ON PREFERENTIAL SPUTTERING.
Goktepe, O.F.
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Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 1985, B7-8 (pt 2) : 803 - 807
[10] KINETICS OF THE SURFACE CONCENTRATION OF COMPONENTS OF AN ALLOY DURING EVAPORATION AND SPUTTERING.
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