Effect of some additives on volumes of activation in the electrodeposition of cobalt, nickel, and silver

被引：0

作者：

机构：

[1] Franklin, Thomas C.

[2] Mathew, Shaj A.

来源：

Franklin, Thomas C. | 1600年 / 136期

关键词：

Electroplating;

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暂无

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引用

共 50 条

[41] The effect of additives on the pulsed electrodeposition of copper
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[47] EFFECT OF NICKEL ON THE ELECTRODEPOSITION OF COPPER
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[48] EFFECT OF DEPASSIVATION AT SPECIFIC CRYSTAL FACETS ON STATE OF ACTIVATION OF NICKEL SUBSTRATES FOR ELECTRODEPOSITION
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[49] ELECTRODEPOSITION OF SILVER-NICKEL ALLOY IN POWDER FORM
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[50] SOME MECHANISMS OF ACTION OF ADDITIVES IN ELECTRODEPOSITION AND DISSOLUTION OF METALS
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