Technique for measuring residual stress in SiC whiskers within an alumina matrix through Raman spectroscopy

被引:0
|
作者
机构
来源
| 1600年 / 71期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Detection of residual stress in silicon carbide MEMS by μ-Raman spectroscopy
    Zingarelli, JC
    Marciniak, MA
    Foley, JR
    Micro- and Nanosystems-Materials and Devices, 2005, 872 : 43 - 48
  • [22] Residual stress measurement in a metal microdevice by micro Raman spectroscopy
    Song, Chang
    Du, Liqun
    Qi, Leijie
    Li, Yu
    Li, Xiaojun
    Li, Yuanqi
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017, 27 (10)
  • [23] Measurement of interfacial residual stress in SiC fiber reinforced Ni-Cr-Al alloy composites by Raman spectroscopy
    Xixi Niu
    Haoqiang Zhang
    Zhiliang Pei
    Nanlin Shi
    Chao Sun
    Jun Gong
    JournalofMaterialsScience&Technology, 2019, 35 (01) : 88 - 93
  • [24] Measurement of interfacial residual stress in SiC fiber reinforced Ni-Cr-Al alloy composites by Raman spectroscopy
    Niu, Xixi
    Zhang, Haoqiang
    Pei, Zhiliang
    Shi, Nanlin
    Sun, Chao
    Gong, Jun
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 35 (01) : 88 - 93
  • [25] A new quantitative determination of stress by Raman spectroscopy in diamond grown on alumina
    Fang, ZJ
    Xia, YB
    Wang, LJ
    Wang, ZM
    JOURNAL OF PHYSICS-CONDENSED MATTER, 2002, 14 (21) : 5271 - 5276
  • [26] Regulation of Residual Stress in SiC Fiber Reinforced TiAl Matrix Composites
    Wang, Minjuan
    Chen, Yonggang
    Gao, Fan
    Li, Hu
    Huang, Xu
    Huang, Hao
    Xiyou Jinshu/Chinese Journal of Rare Metals, 2023, 47 (06): : 787 - 796
  • [27] Novel residual stress measurement technique to evaluate through thickness residual stress fields
    Taraphdar, P. K.
    Thakare, J. G.
    Pandey, Chandan
    Mahapatra, M. M.
    MATERIALS LETTERS, 2020, 277
  • [28] In-depth analysis of residual stress in an alumina coating on silicon nitride substrate using confocal Raman piezo-spectroscopy
    Ohtsuka, Shigehiro
    Zhu, Wenliang
    Tochino, Shigemi
    Sekiguchi, Yutaka
    Pezzotti, Giuseppe
    ACTA MATERIALIA, 2007, 55 (04) : 1129 - 1135
  • [29] Evaluation of Thermal Cycle Stress in SiC Power Devices by Raman Spectroscopy
    Uchida, Tomoyuki
    Sugie, Ryuichi
    2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2018, : 579 - 582
  • [30] Thermal residual micro-stress concentration and stength of SiC-alumina nanocomposites
    Kovalev, S
    Ohji, T
    Yamauchi, Y
    Sakai, M
    SCIENCE OF ENGINEERING CERAMICS II, 1999, 2 : 397 - 400