Deposition of a molten layer of high melting point material: substrate melting and resolidification

被引：0

作者：

Wang, S.-P. ^{[1
]}

Wang, G.-X. ^{[1
]}

Matthys, E.F. ^{[1
]}

机构：

[1] Univ of California, Santa Barbara, United States

来源：

Materials Science and Engineering A | 1999年 / 262卷 / 01期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：25 / 32

共 50 条

[41] Melting point of high-purity silicon
Gayler, MLV
NATURE, 1938, 142 : 478 - 478
[42] Thermal properties of high melting point copolyesters
Edling, Hans
Turner, Sam
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2015, 250
[43] SOME FEATURES OF PURIFICATION OF HIGH-MELTING POINT METALS BY ELECTRON BEAM MELTING
EFIMOV, VE
RUSSIAN METALLURGY-METALLY-USSR, 1970, (03): : 31 - &
[44] A DEVICE FOR ZONAL MELTING OF HIGH-MELTING POINT METALS AND ALLOYS BY ELECTRON BOMBARDMENT
SAVITSKII, EM
KOPETSKII, CV
PEKAREV, AI
NOVOSADOV, MI
INDUSTRIAL LABORATORY, 1961, 27 (08): : 1040 - 1041
[45] A NATURAL-CONVECTION MODEL OF MOLTEN POOL PENETRATION INTO A MELTING MISCIBLE SUBSTRATE
EPSTEIN, M
NUCLEAR ENGINEERING AND DESIGN, 1994, 152 (1-3) : 319 - 330
[46] Investigation of melting and resolidification of Sm1.8Ba2.4Cu3.4Ox in Ba-Cu-O melt at the temperature below its melting point
Kim, CJ
Jee, YA
Hong, GW
Sung, TH
Han, YH
Han, SC
Kim, SJ
JOURNAL OF MATERIALS SCIENCE LETTERS, 2000, 19 (14) : 1253 - 1254
[47] Productization for Heatproof Embedded Substrate with Sn-Sb High Melting Point Solder Attachment
Toda M.
Journal of Japan Institute of Electronics Packaging, 2023, 26 (07) : 650 - 656
[48] Electrochemical deposition of superconductor alloy precursor in a low melting molten salt medium
Univ of Hong Kong, Hong Kong, Hong Kong
J Appl Electrochem, 7 (857-861):
[49] Electrochemical deposition of superconductor alloy precursor in a low melting molten salt medium
Fung, YS
Zhang, WB
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1997, 27 (07) : 857 - 861
[50] Electrochemical deposition of superconductor alloy precursor in a low melting molten salt medium
Y. S. FUNG
W. B. ZHANG
Journal of Applied Electrochemistry, 1997, 27 : 857 - 861

← 1 2 3 4 5 →