Effects of curing conditions and test temperatures on the strength of adhesive-bonded joints

被引：0

|

作者：

Matsui, K. ^{[1
]}

机构：

[1] Univ of Tokushima Bunri, Tokushima, Japan

来源：

International Journal of Adhesion and Adhesives | 1990年 / 10卷 / 04期

关键词：

Joints; Adhesive;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

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页码：277 / 284

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