共 50 条
- [41] Wafer contamination protection by direct wafer bonding and air jet debonding SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS V, PROCEEDINGS, 2001, 99 (35): : 195 - 199
- [42] THE ROAD TO WAFER-ON-WAFER (WOW) HIGH VOLUME MANUFACTURING (HVM)-ADVANCED SENSING IN WAFER HANDLING 2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC), 2018,
- [43] TECHNIQUES FOR HANDLING METALLIC WHISKERS REVIEW OF SCIENTIFIC INSTRUMENTS, 1959, 30 (11): : 982 - 983
- [45] A Multi-Scale Approach to Wafer to Wafer Metallic Bonding in MEMS 2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2013,
- [46] A Novel Temporary Adhesive for Thin Wafer Handling 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 256 - 261
- [50] Error Modeling and Analysis in Dynamic Wafer Handling PROCEEDINGS OF THE 10TH WORLD CONGRESS ON INTELLIGENT CONTROL AND AUTOMATION (WCICA 2012), 2012, : 3977 - 3982