A novel photosensitive porous low-k interlayer dielectric film

被引：0
|
作者：
Kuroki, Shin-Ichiro [1 ]
Sakamoto, Susumu [1 ]
Kikkawa, Takamaro [1 ]
机构：
[1] Res. Ctr. for Nanodevices/Systems, Hiroshima University, 1-4-2 Kagamiyama, Higashi-Hiroshima 739-8527, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 2004年 / 43卷 / 4 B期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1820 / 1824
相关论文
共 50 条
  • [1] A novel photosensitive porous low-k interlayer dielectric film
    Kuroki, S
    Sakamoto, S
    Kikkawa, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2004, 43 (4B): : 1820 - 1824
  • [2] Photosensitive porous low-k interlayer dielectric film
    Kuroki, S
    Kikkawa, T
    NANOFABRICATION: TECHNOLOGIES, DEVICES AND APPLICATIONS, 2004, 5592 : 170 - 174
  • [3] A photosensitive low-k interlayer-dielectric film for ULSIs
    Kikkawa, T
    SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 348 - 351
  • [4] TDDB in a deuterated low-k interlayer dielectric
    Lloyd, J. R.
    Lenahan, P. M.
    Mahmud, N.
    Waskiewicz, R. J.
    2019 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2019, : 142 - 145
  • [5] Porous methylsilsesquioxane for low-k dielectric applications
    Padovani, AM
    Rhodes, L
    Riester, L
    Lohman, G
    Tsuie, B
    Conner, J
    Allen, SAB
    Kohl, PA
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2001, 4 (11) : F25 - F28
  • [6] Solvent diffusion in porous low-k dielectric films
    Shamiryan, D
    Maex, K
    MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2003, 2003, 766 : 229 - 234
  • [7] FUNDAMENTAL UNDERSTANDING OF POROUS LOW-K DIELECTRIC BREAKDOWN
    Lee, Shou-Chung
    Oates, A. S.
    Chang, Kow-Ming
    2009 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, VOLS 1 AND 2, 2009, : 481 - +
  • [8] A study of the dielectric constant of low-k SiOC film
    Oh, Teresa
    JOURNAL OF CERAMIC PROCESSING RESEARCH, 2010, 11 (06): : 648 - 651
  • [9] Characterization of low-k benzocyclobutene dielectric thin film
    Chan, KC
    Teo, M
    Zhong, ZW
    MICROELECTRONICS INTERNATIONAL, 2003, 20 (03) : 11 - 22
  • [10] Study of metal/barrier/low-k interfaces for interlayer dielectric applications
    Chang, JP
    Case, CB
    Krautter, HW
    Sapjeta, J
    Opila, RL
    Decker, MA
    INTERCONNECT AND CONTACT METALLIZATION FOR ULSI, 2000, 99 (31): : 261 - 269
12345