New technology of electroless gold plating on PCB

被引:0
|
作者
Hu, Wencheng
Chi, Lanzhou
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Initiation electroless nickel plating by atomic hydrogen for PCB final finishing
    Lin, Jianhui
    Wang, Chong
    Wang, Shouxu
    Chen, Yuanming
    He, Wei
    Xiao, Dingjun
    CHEMICAL ENGINEERING JOURNAL, 2016, 306 : 117 - 123
  • [22] ELECTROLESS PLATING - ITS APPLICATIONS IN RESISTOR TECHNOLOGY
    DEARDEN, J
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1976, 3 (02): : 103 - 111
  • [23] ELECTROLESS PLATING FOR SURFACE-MOUNT TECHNOLOGY
    POSKANZER, AM
    PLATING AND SURFACE FINISHING, 1987, 74 (06): : 12 - +
  • [24] Gold wire bondability of electroless gold plating using disulfiteaurate complex
    H. Watanabe
    S. Abe
    H. Honma
    Journal of Applied Electrochemistry, 1998, 28 : 525 - 529
  • [25] Gold wire bondability of electroless gold plating using disulfiteaurate complex
    Watanabe, H
    Abe, S
    Honma, H
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 1998, 28 (05) : 525 - 529
  • [26] Electroless nickel/gold plating on copper based semiconductors
    Strandjord, AJG
    Popelar, SF
    Erickson, CA
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 196 - 201
  • [27] Factors influencing the electroless gold plating for ceramic packaging
    Zhang, Lei
    Liu, Sheng-Qian
    Liu, Qiao-Ming
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 463 - 465
  • [28] Fabrication of patterned gold microstructure by selective electroless plating
    Guan, F
    Chen, MA
    Yang, W
    Wang, JQ
    Yong, SR
    Xue, QJ
    APPLIED SURFACE SCIENCE, 2005, 240 (1-4) : 24 - 27
  • [29] DEVELOPMENT of NEW MICRO GAS PRECONCENTRATOR USING NOVEL ELECTROLESS GOLD PLATING PROCESS
    Kuo, C. -Y.
    Chen, P. -S.
    Chiu, K. -J
    Lu, C. -J.
    Tian, W. -C.
    2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2015, : 1456 - 1459
  • [30] New challenges for electroless plating technologies
    Hajdu, Juan
    Transactions of the Institute of Metal Finishing, 1997, 75 (pt 1):