EVALUATION OF SOLDER BUMP FLIP CHIPS IN THICK FILM SOLDER REFLOW HYBRIDS.

被引：0
|
作者：
Brownewell, Don
机构：
来源：
Insulation/Circuits | 1975年 / 21卷 / 05期
关键词：
SEMICONDUCTOR DEVICE MANUFACTURE - SEMICONDUCTOR DEVICES - SOLDERS;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Device assembly techniques for hybrid circuits, and semiconductor devices are illustrated and comparatively tabulated. Both process and assembly flow comparison, and economic, and design and operational decision matrix is shown.
引用
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页码：33 / 36
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