Endurance of lead-free assembly under board level drop test and thermal cycling

被引：0
|
作者：
Xia, Yanghua [1 ]
Xie, Xiaoming [1 ]
机构：
[1] State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, China
来源：
Journal of Alloys and Compounds | 2008年 / 457卷 / 1-2期
关键词：
32;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：198 / 203
相关论文
共 50 条
  • [41] Board-level reliability of lead-free SnAgCu solder joint
    Wu, JS
    Yu, SP
    Peng, IH
    Wang, JL
    Chung, B
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 282 - 286
  • [42] Practicalities of lead-free assembly
    Lea, Colin
    Global SMT and Packaging, 2003, 3 (04):
  • [43] The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
    Chen, Si
    Cheng, Zhaonian
    Liu, Johan
    Gao, Yulai
    Zhai, Qijie
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 1159 - +
  • [44] The effects of thermal cycling on electromigration behaviors in lead-free solder joints
    Yong, Zuo
    Ma, Limin
    Yue, Lu
    Liu, Sihan
    Guo, Fu
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1068 - 1071
  • [45] A Comprehensive Analysis of the Thermal Cycling Reliability of Lead-Free Chip Scale Package Assemblies with Various Reworkable Board-Level Polymeric Reinforcement Strategies
    Shi, Hongbin
    Tian, Cuihua
    Yu, Daquan
    Ueda, Toshitsugu
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 958 - 969
  • [46] Lead-free SMD assembly
    Koehler, Rainer
    F and M; Feinwerktechnik, Mikrotechnik, Messtechnik, 1998, 106 (12): : 913 - 915
  • [47] Computational Parametric Study on the Strain Hardening Effect of Lead-free Solder Joints in Board Level Mechanical Drop Tests
    Jiang, Tong
    Xu Zhengjian
    Lee, S. W. Ricky
    Song, Fubin
    Lo, Jeffery C. C.
    Yang, Chaoran
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [48] Thermal cycling reliability of lead-free chip resistor solder joints
    Suhling, JC
    Gale, HS
    Johnson, RW
    Islam, MN
    Shete, T
    Lall, P
    Bozack, MJ
    Evans, JL
    Seto, P
    Gupta, T
    Thompson, JR
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (02) : 77 - 87
  • [49] Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications
    Yeh, CL
    Lai, YS
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 695 - 700
  • [50] Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
    Xu, Luhua
    Pang, John H. L.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 275 - +
12345