Solder electromigration in Cu/In/Cu flip chip joint system

被引：0
|
作者：
Yamanaka, Kimihiro [1 ]
Tsukada, Yutaka [1 ]
Suganuma, Katsuaki [2 ]
机构：
[1] Advanced Packaging Laboratory, KYOCERA SLC Technologies Corporation, 656 Ichimiyake Yasu, Shiga, 520-2362, Japan
[2] Nanoscience and Nanotechnology Center, The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
来源：
Journal of Alloys and Compounds | 2007年 / 437卷 / 1-2期
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页码：186 / 190
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