Modeling the electromigration failure time distribution in short copper interconnects

被引：0
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作者：
Dwyer, V.M. [1 ]
机构：
[1] Department of Electronic and Electrical Engineering, Loughborough University, Loughborough LE11 3TU, United Kingdom
来源：
Journal of Applied Physics | 2008年 / 104卷 / 05期
关键词：
Electromigration;
D O I：
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学科分类号：
摘要：
Journal article (JA)
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