Ultra-fine-grained copper with high strength and conductivity fabricated by Severe deformation of asymmetrical accumulative roll bonding

被引：3

作者：

Wang J.-L. ^{[1
]}

Shi Q.-N. ^{[1
]}

Qian T.-C. ^{[1
]}

Wang S.-H. ^{[1
]}

Yang X.-K. ^{[1
]}

机构：

[1] Research Center for Analysis and Measurement, Kunming University of science and Technology

来源：

Hangkong Cailiao Xuebao/Journal of Aeronautical Materials | 2010年 / 30卷 / 03期

关键词：

Asymmetrical accumulative rolling bonding; Oxygen-free copper; Severe deformation; Ultra-fine grained materials;

D O I：

10.3969/j.issn.1005-5053.2010.3.004

中图分类号：

学科分类号：

摘要：

Ultra-fine-grained copper was prepared by asymmetrical accumulative rolling bonding (AARB) with annealing. The main characteristics of AARB technology were discussed, including rubbed rolling area, interface and deformation rate, the structures and properties were measured. The results show that the rubbed rolling area promotes the interface recombination and grains refinement. There are much sub-structures within oxygen-free copper after AARB for six passes with 4.01 cumulative true, thereafter, when annealed by 220°C/35min, the sub-structures disappear and the ultra-fine-grained copper with high strength and conductivity has been obtained, which grain size is 200nm, tensile strength and yield strength are 424.5 MPa and 323.1 MPa respectively and electrical conductivity is 76.3MS/m. The increase of grain boundary area of ultra-fine-grained copper increases the microhardness. Small uneven deformation and stress concentration for ultra-fine grained copper lead to a better good plastic and higher intensity. The plastic deformation mechanism of ultra-fine-grained copper is controlled by grain boundary.

引用

页码：14 / 18

页数：4