Optoelectronic packaging for optical interconnects

被引：10
|
作者：
Lee, Sing H. [1 ]
Lee, Y.C. [2 ]
机构：
[1] Department of Electrical and Computer Engineering, University of California, San Diego, United States
[2] Department of Mechanical Engineering, University of Colorado, Boulder, CO, United States
来源：
Optics and Photonics News | 2006年 / 17卷 / 01期
关键词：
Electronic equipment - Electronics packaging - Heat sinks - Microelectromechanical devices - Optical interconnects - Photodetectors - Semiconductor lasers;
D O I：
10.1364/OPN.17.1.000040
中图分类号：
学科分类号：
摘要：
The technologies and developments that are required to develop optoelectronics packages that can be manufactured reliably in large quantities and at competitive costs are discussed. Wire bonding technology for optoelectronic packaging is used when high connection density is not required, between a photodetector and its receiver electronics. Die attach technology is often applied to attach semiconductor laser and optical amplifier dies to submounts or heat sinks to spread the heat generated in their active region. In future, microelectromechanical Systems (MEMS) is anticipated to help simplify alignment for optoelectronic packaging.
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页码：40 / 45
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