Optoelectronic packaging for optical interconnects

被引：10
|
作者：
Lee, Sing H. [1 ]
Lee, Y.C. [2 ]
机构：
[1] Department of Electrical and Computer Engineering, University of California, San Diego, United States
[2] Department of Mechanical Engineering, University of Colorado, Boulder, CO, United States
来源：
Optics and Photonics News | 2006年 / 17卷 / 01期
关键词：
Electronic equipment - Electronics packaging - Heat sinks - Microelectromechanical devices - Optical interconnects - Photodetectors - Semiconductor lasers;
D O I：
10.1364/OPN.17.1.000040
中图分类号：
学科分类号：
摘要：
The technologies and developments that are required to develop optoelectronics packages that can be manufactured reliably in large quantities and at competitive costs are discussed. Wire bonding technology for optoelectronic packaging is used when high connection density is not required, between a photodetector and its receiver electronics. Die attach technology is often applied to attach semiconductor laser and optical amplifier dies to submounts or heat sinks to spread the heat generated in their active region. In future, microelectromechanical Systems (MEMS) is anticipated to help simplify alignment for optoelectronic packaging.
引用
收藏
页码：40 / 45
相关论文
共 50 条
  • [1] OPTICAL INTERCONNECTS AND PACKAGING
    LEE, SH
    OPTICAL ENGINEERING, 1994, 33 (05) : 1511 - 1511
  • [2] Micromachined low dispersion interconnects for optoelectronic array packaging
    Banerjee, SR
    Drayton, RF
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 1565 - 1568
  • [3] Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects
    Wang, Yixiao
    Overmeyer, Ludger
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2018, 24 (06)
  • [4] Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules
    Goossen, KW
    2004 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2004, : 653 - 654
  • [5] INTEGRATED OPTICAL/OPTOELECTRONIC SWITCH FOR PARALLEL OPTICAL INTERCONNECTS
    LU, YC
    CHENG, J
    ZOLPER, JC
    KLEM, J
    ELECTRONICS LETTERS, 1995, 31 (07) : 579 - 581
  • [6] Advanced organic materials for optoelectronic integrated devices, interconnects, and packaging
    Sandalphon
    Hendrickx, E
    Herlocker, J
    Jabbour, GE
    Kawabe, Y
    Kippelen, B
    Morrell, MM
    Shaheen, SE
    Steele, DD
    Wang, JF
    Peyghambarian, N
    SCIENCE AND TECHNOLOGY OF POLYMERS AND ADVANCED MATERIALS: EMERGING TECHNOLOGIES AND BUSINESS OPPORTUNITIES, 1998, : 375 - 384
  • [7] Progress in packaging of parallel optical interconnects
    Plickert, V
    Melchior, L
    Franke, M
    Carl, R
    Hildebrandt, P
    Staudemeyer, NP
    LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 667 - 668
  • [8] A pair of integrated optoelectronic chips for optical interconnects
    Wei, Qi
    Liu, Kai
    Huang, Yongqing
    Duan, Xiaofeng
    Wang, Qi
    Ren, Xiaomin
    Cai, Shiwei
    2018 ASIA COMMUNICATIONS AND PHOTONICS CONFERENCE (ACP), 2018,
  • [9] FUTURE OPTOELECTRONIC SYSTEMS REQUIRE OPTICAL INTERCONNECTS
    LINKE, RA
    LASER FOCUS WORLD, 1993, 29 (07): : 27 - &
  • [10] INTEGRATED OPTOELECTRONIC MATERIALS AND CIRCUITS FOR OPTICAL INTERCONNECTS
    HUTCHESON, LD
    JOURNAL OF ELECTRONIC MATERIALS, 1989, 18 (02) : 259 - 265
12345