Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy

被引：0
|
作者：
Das, S.K. [1 ]
Sharif, A. [2 ]
Chan, Y.C. [1 ]
Wong, N.B. [3 ]
Yung, W.K.C. [4 ]
机构：
[1] Department of Electronic Engineering, City University of Hong Kong, Hong Kong
[2] Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka, 1000, Bangladesh
[3] Department of Biology and Chemistry, City University of Hong Kong, Hong Kong
[4] Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong
来源：
Journal of Alloys and Compounds | 2009年 / 481卷 / 1-2期
关键词：
34;
D O I：
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中图分类号：
学科分类号：
摘要：
Journal article (JA)
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页码：167 / 172
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