Finite element analysis of stress-induced voiding in copper interconnects

被引：0
|
作者：
Peng, Jie [1 ]
Han, Junwu [1 ]
Wu, Zhenyu [1 ]
Yang, Yintang [1 ]
Wei, Jingtian [1 ]
Zhu, Lili [1 ]
机构：
[1] Institute of Microelectronics, Xidian University, Xi'an 710071, China
来源：
Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology | 2012年 / 32卷 / 06期
关键词：
D O I：
10.3969/j.issn.1672-7126.2012.06.03
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学科分类号：
摘要：
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页码：463 / 467
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