Fabrication of metal micro-precision sieves with high open areas using UV-LIGA process

被引:0
|
作者
Ming, Ping-Mei [1 ,2 ]
Zhu, Di [1 ]
Zhou, Feng [1 ]
Hu, Yang-Yang [1 ]
Zeng, Yong-Bin [1 ]
机构
[1] Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
[2] School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
关键词
Fabrication - Nickel - Photoresists - Aspect ratio;
D O I
暂无
中图分类号
学科分类号
摘要
The manufacture of thick micro-precision sieve-sheets with high open areas is a key technical challenge. After analysis on the process limitations existing in three manufacturing methods for metal micro-precision sieves, an optimized UV-LIGA technique based on SU-8 photoresist is presented to manufacture the micromesh nickel sieve-sheets. Operational parameters of some key process steps for fabricating micro-precision sieve-sheets are determined experimentally, and morphological characteristics of electroformed hexagon micromesh nickel sieves are evaluated using a SEM and an optical profiler. Experimental results show that, using the UV-LIGA process, hexagon micromesh nickel sieves (200 μm in side length, 50 mm in diameter and 120 μm in thickness) with an open-area percent of 88% and a sheet-thickness of 120 μm, which can hardly be achieved by the conventional machining methods, are successfully machined. The machined sieves are characterized by their smooth surfaces and aperture walls, high precision sizes as well as rigid and homogeneous structures. These results show that the UV-LIGA is an excellent method for fabricating micro-precision metal sieves.
引用
收藏
页码:1267 / 1273
相关论文
共 50 条
  • [41] Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insert
    Yeh, YM
    Tu, GC
    Fu, MN
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2003, 42 (10): : 6683 - 6690
  • [42] Fabrication of micro-capacitive inclination sensor using the LIGA process
    Kuboyama, Yuu
    Nishida, Satoshi
    Noda, Daiji
    Hattori, Tadashi
    EMERGING TECHNOLOGY IN PRECISION ENGINEERING XIV, 2012, 523-524 : 592 - +
  • [43] Design and Fabrication of a 1-DOF Drive Mode and 2-DOF Sense Mode Micro-gyroscope using SU-8 based UV-LIGA Process
    Verma, Payal
    Juneja, Sucheta
    Savelyev, Dmitry A.
    Khonina, Svetlana N.
    Gopal, Ram
    2ND INTERNATIONAL CONFERENCE ON EMERGING TECHNOLOGIES: MICRO TO NANO 2015 (ETMN-2015), 2016, 1724
  • [44] New formation technology for a plasma display panel barrier-rib structure using a precise metal mold fabricated by the UV-LIGA process
    Son, SH
    Park, YS
    Choi, SY
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (01) : 63 - 69
  • [45] A 1.0-THz High-Gain Metal-Only Transmit-Array Antenna Based on High-Precision UV-LIGA Microfabrication Technology
    Miao, Zhuo-Wei
    Liu, Zhenhao
    Hao, Zhang-Cheng
    Zeng, Yongbin
    Zhu, Di
    Zhao, Jia-Hui
    Ding, Chen-Yu
    Cheng, Li
    Zhao, Lei
    Hong, Wei
    IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2024, 14 (02) : 269 - 282
  • [46] Different methods for the fabrication of UV-LIGA molds using SU-8 with tapered de-molding angles
    C. Fu
    H. Huang
    Microsystem Technologies, 2007, 13 : 293 - 298
  • [47] Different methods for the fabrication of UV-LIGA molds using SU-8 with tapered de-molding angles
    Fu, C.
    Huang, H.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (3-4): : 293 - 298
  • [48] Batch-mode micropatterning of carbon nanotube forests using UV-LIGA assisted micro-electro-discharge machining
    Sarwar, Mirza Saquib Us
    Dahmardeh, Masoud
    Nojeh, Alireza
    Takahata, Kenichi
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2014, 214 (11) : 2537 - 2544
  • [49] Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector
    Isono, Y
    Tada, J
    Watanabe, T
    Unno, T
    Toriyama, T
    Sugiyama, S
    BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2003, : 456 - 459
  • [50] Study on fabrication of high aspect ratio microparts using the LIGA process
    Ueno, H
    Hosaka, M
    Zhang, Y
    Tabata, O
    Konishi, S
    Sugiyama, S
    MHS'97: PROCEEDINGS OF 1997 INTERNATIONAL SYMPOSIUM ON MICROMECHATRONICS AND HUMAN SCIENCE, 1997, : 49 - 54