Grain boundary surface tension, segregation and diffusion in Cu-Sn system

被引：0
|
作者：
Evgeny, Gershman [1 ]
Sergey, Zhevnenko [1 ]
机构：
[1] Moscow State Institute of Steel and Alloys (Technological University), 4, Leninsky pr, Moscow, 119049, Russia
来源：
Defect and Diffusion Forum | 2007年 / 264卷
关键词：
Copper compounds;
D O I：
10.4028/3-908451-41-8.39
中图分类号：
学科分类号：
摘要：
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页码：39 / 46
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