Relationship between temperature drift and thermal expansion of sensing structure in sandwich micro-accelerometer

被引：2
|
作者：
Qiang, Dai [1 ,2 ]
Gang, Jiang [1 ]
Wei, Su [2 ]
De, Zhang [2 ]
Bo, Peng [2 ]
机构：
[1] Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, School of manufacturing, Southwest University of Science and Technology, Mianyang,Sichuan,621010, China
[2] Electronic Engineering Research Institute of China Academy of Engineering Physics, Mianyang,Sichuan,621900, China
来源：
Micro and Nanosystems | 2014年 / 6卷 / 01期
关键词：
Thermal expansion;
D O I：
10.2174/187640290601140919144733
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：50 / 54
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