Room-temperature bonding of GaN to Al using Ar-Beam surface activation

被引:0
|
作者
Research Center for Advanced Science and Technology, University of Tokyo, 4-6-1, Komaba, Meguro-ku, Tokyo 153-8904, Japan [1 ]
不详 [2 ]
机构
来源
IEEJ Trans. Sens. Micromach. | / 8卷 / 369-372期
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
Gallium nitride
引用
收藏
相关论文
共 50 条
  • [41] Void-free room-temperature silicon wafer direct bonding using sequential plasma activation
    Wang, Chenxi
    Higurashi, Eiji
    Suga, Tadatomo
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (04) : 2526 - 2530
  • [42] Comparison of low- and room-temperature damage formation in Ar ion implanted GaN and ZnO
    Wendler, E.
    Wesch, W.
    Azarov, A. Yu.
    Catarino, N.
    Redondo-Cubero, A.
    Alves, E.
    Lorenz, K.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2013, 307 : 394 - 398
  • [43] Room Temperature Bonding method for polymer films by Surface Activated Bonding method using Al intermediate layer
    Matsumae, Takashi
    Fujino, Masahisa
    Suga, Tadatomo
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 204 - 207
  • [44] Room-Temperature Plasticity of a Nanosized GaN Crystal
    Fujikane, Masaki
    Nagao, Shijo
    Chrobak, Dariusz
    Yokogawa, Toshiya
    Nowak, Roman
    NANO LETTERS, 2021, 21 (15) : 6425 - 6431
  • [45] Room-temperature ferromagnetism in dielectric GaN(Gd)
    Litvinov, V. I.
    Dugaev, V. K.
    APPLIED PHYSICS LETTERS, 2009, 94 (21)
  • [46] Room-temperature photoenhanced wet etching of GaN
    Minsky, MS
    White, M
    Hu, EL
    APPLIED PHYSICS LETTERS, 1996, 68 (11) : 1531 - 1533
  • [47] Halogen bonding in room-temperature phosphorescent materials
    Wang, Weizhou
    Zhang, Yu
    Jin, Wei Jun
    COORDINATION CHEMISTRY REVIEWS, 2020, 404
  • [48] Room Temperature Wafer Bonding Using Surface Activated Bonding Method
    Taniyama, Shingo
    Wang, Ying-Hui
    Fujino, Masahisa
    Suga, Tadatomo
    IEEE 9TH VLSI PACKAGING WORKSHOP IN JAPAN, 2008, : 141 - 144
  • [49] Mechanism of bond formation and effects of surface roughness in room-temperature wafer bonding
    Takagi, Hideki
    Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2000, 69 (02): : 62 - 64
  • [50] Room-temperature interconnection of electroplated an microbump by means of surface activated bonding method
    Matsuzawa, Y
    Itoh, T
    Suga, T
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 384 - 387