Scanning capacitance microscopy (SCM) applications in failure analysis

被引：0
|
作者：
Wang, Xiang-Dong [1 ]
机构：
[1] Freescale Semiconductor Inc., United States
来源：
Electronic Device Failure Analysis | 2011年 / 13卷 / 04期
关键词：
D O I：
10.31399/asm.edfa.2011-4.p014
中图分类号：
学科分类号：
摘要：
16
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页码：14 / 19
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