Latest trends in ultra-precision polishing/chemical mechanical polishing (CMP) (Part 2) - CMP technology and tribo-chemical assisted polishing

被引：0
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作者：
Doi, Toshiro [1 ]
Kurokawa, Syuhei [1 ]
Ohnishi, Osamu [1 ]
Yamazaki, Tsutomu [1 ]
机构：
[1] Department of Mechanical Engineering, Faculty of Engineering, Kyushu University, 744, Motooka, Nishi-ku, Fukuoka-shi, Fukuoka 819-0395, Japan
来源：
Toraibarojisuto/Journal of Japanese Society of Tribologists | 2010年 / 55卷 / 11期
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页码：809 / 813
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