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- [21] PCB Engineering for Improving Temperature Cycling Reliability of Lead-free Solder Ball Joint 2017 IEEE 24TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2017,
- [22] Research on failure modes of BGA assemblies with lead-free solder on different PCB materials FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 396 - 400
- [25] Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1466 - 1471
- [26] Effects of PCB Design Variations on Bend and ATC Performance of Lead-Free Solder Joints 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1512 - 1517
- [27] Study of Drop-performance Improved Lead-free Solder by PCB Pad Finish 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 668 - 672
- [29] Creep and microstructural evolution in lead-free microelectronic solder joints ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 417 - 422