Effects of Ni on the performance of Sn2.5Ag0.7Cu0.1RE solder alloy and its solder joints

被引:0
|
作者
Fan, Yanli [1 ]
Zhang, Keke [1 ]
Wang, Yaoli [1 ]
Zhu, Yaomin [1 ]
Zhang, Xin [1 ]
Yan, Yanfu [1 ]
机构
[1] Materials Science and Engineering College, Henan University of Science and Technology, Luoyang 471003, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:651 / 653
相关论文
共 50 条
  • [41] Effect of Solder Thick on the Interfacial Reaction in Cu/Sn/Ni Solder Joints
    Liang, Wang-rong
    Zhang, Zhi-jie
    Dang, Rui-xi
    Zhou, Xu
    Wei, Hong
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [42] Effects of Ag particles content on properties of Sn0.7Cu solder
    Li Yang
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 1405 - 1409
  • [43] Effect of Ni content on the creep properties of Cu/Sn-0.3Ag-0.7Cu/Cu solder micro-joints
    Yao, Zongxiang
    Ling, Diying
    Yin, Limeng
    Wang, Gang
    Zhang, Hehe
    Jiang, Shan
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (07) : 5462 - 5470
  • [44] Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints
    Hao, Hu
    Tian, Jun
    Xu, Guangchen
    Gu, Fu
    Song, Yonglun
    Shi, Yaowu
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 793 - 796
  • [45] Effects of Ag particles content on properties of Sn0.7Cu solder
    Yang, Li
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (05) : 1405 - 1409
  • [46] Size Effect on the Intermetallic Compound Coalescence in Sn-Ag-Cu Solder and Sn-Ag-Cu/Cu Solder Joints
    Zhou Min-Bo
    Ma Xiao
    Zhang Xin-Ping
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 248 - 253
  • [47] Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints
    Xie, H. X.
    Chawla, N.
    MICROELECTRONICS RELIABILITY, 2013, 53 (05) : 733 - 740
  • [48] Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints
    Tai, Feng
    Guo, Fu
    Xia, Zhi-dong
    Lei, Yong-ping
    Shi, Yao-wu
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2009, 16 (06) : 677 - 684
  • [50] Solder Characteristics of a Rapidly Solidified Sn-9Zn-0.1Cr Alloy and Mechanical Properties of Cu/Solder/Cu Joints
    Guoji Zhao
    Guangmin Sheng
    Jun Luo
    Xinjian Yuan
    Journal of Electronic Materials, 2012, 41 : 2100 - 2106