Polarity effect of electromigration and its influence on tensile properties of Sn-3.0Ag-0.5Cu lead-free solder joint

被引：0
|
作者：
Yao, Jian [1 ]
Wei, Guo-Qiang [1 ]
Shi, Yong-Hua [1 ]
Gu, Feng [1 ]
机构：
[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2011年 / 21卷 / 12期
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页码：3094 / 3099
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