Polarity effect of electromigration and its influence on tensile properties of Sn-3.0Ag-0.5Cu lead-free solder joint

被引：0
|
作者：
Yao, Jian [1 ]
Wei, Guo-Qiang [1 ]
Shi, Yong-Hua [1 ]
Gu, Feng [1 ]
机构：
[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2011年 / 21卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：3094 / 3099
相关论文
共 50 条
  • [1] The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder
    Zhang, Huihui
    Xu, Zhefeng
    Wang, Yan
    Tian, Caili
    Fan, Changzeng
    Motozuka, Satoshi
    Yu, Jinku
    METALS, 2024, 14 (10)
  • [2] Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy
    Lu, Bin
    Li, Hui
    Wang, Juan-Hui
    Zhu, Hua-Wei
    Jiao, Xian-He
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2007, 17 (04): : 518 - 524
  • [3] Effects of impurities on solderability of Sn-3.0Ag-0.5Cu lead-free solder
    Katayama, N
    Tanaka, H
    Akanuma, M
    Miyazaki, M
    Nomura, S
    Takei, T
    Takemoto, T
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1027 - 1030
  • [4] Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
    Wang, Mingna
    Wang, Jianqiu
    Ke, Wei
    MICROELECTRONICS RELIABILITY, 2017, 73 : 69 - 75
  • [5] Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application
    Jamadon, Nashrah Hani
    Yusof, Farazila
    Abd Shukor, Mohd Hamdi
    Ariga, Tadashi
    Miyashita, Yukio
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
  • [6] MICROSTRUCTURAL INVESTIGATIONS AND MECHANICAL PROPERTIES OF PURE LEAD-FREE (SN-3.0AG-0.5CU AND SN-4.0AG-0.5CU) SOLDER ALLOY
    Pal, Manoj Kumar
    Gergely, Greta
    Horvath, Daniel Koncz
    Gacsi, Zoltan
    METALLURGICAL & MATERIALS ENGINEERING, 2018, 24 (01) : 27 - 36
  • [7] Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte
    Mui Chee Liew
    Ibrahym Ahmad
    Liu Mei Lee
    Muhammad Firdaus Mohd Nazeri
    Habsah Haliman
    Ahmad Azmin Mohamad
    Metallurgical and Materials Transactions A, 2012, 43 : 3742 - 3747
  • [8] Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte
    Liew, Mui Chee
    Ahmad, Ibrahym
    Lee, Liu Mei
    Nazeri, Muhammad Firdaus Mohd
    Haliman, Habsah
    Mohamad, Ahmad Azmin
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2012, 43A (10): : 3742 - 3747
  • [9] Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder
    Wei, Guoqiang
    Wang, Lei
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 452 - 455
  • [10] A Green Approach to Synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy
    Pang, Siu-kwong
    Yung, Kam-chuen
    MATERIALS TRANSACTIONS, 2012, 53 (10) : 1770 - 1774
12345