Fracture Properties Characterization of Multi-Layer Ceramic Capacitors for Device Longevity Assessment

被引：0
|
作者：
Lee, Po-Yi [1 ]
Chen, Kuo-Shen [1 ]
Chiu, Tz-Cheng [1 ]
Yang, Tian-Shiang [1 ]
Ho, Ching-Jenq [1 ]
Chen, Lien-Wen [1 ]
机构：
[1] National Cheng-Kung University, Mechanical Engineering Department, Tainan,70101, Taiwan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Circuit boards - Fracture property - Indentation test - Laminated structures - Multi-layer ceramic capacitor - Multilayer ceramic capacitors - Passive elements - Property characterizations - Thermo-mechanical;
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页码：285 / 286
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